Leaders of the High-tech Industrial Park in Chenzhou, Hunan Province visited the park

      10On the afternoon of the 14th, Lei Gaiping, deputy director of the High-tech Industrial Park of Chenzhou City, Hunan, and a group of five people came to visit the National University of Science and Technology, accompanied by Zhang Wuping, director of the National Technology Transfer Center of East China University of Science and Technology, and Ni Zhengji, director of the National Technology Transfer Center of Shanghai University of Science and Technology, and others.Shen Jianhua, deputy general manager of Shanghai Science and Technology Park Co., Ltd., presided over and held a symposium.
      At the meeting, Shen Jianhua delivered a welcome speech and gave a general introduction to the company's operating mechanism, base expansion, park cultural construction and overall positioning.
      Ni Zhengji, on behalf of the National Technology Transfer Center of Shanghai University of Technology, gave a detailed introduction to the operation mechanism and business characteristics of Shanghai University of Technology's technology transfer.
      Zhang Wuping spoke on behalf of the Shanghai National Technology Transfer Center Alliance.He also made a summary on various matters such as the establishment of a technology transfer workstation in Chenzhou, Hunan.
      Finally, Lei Gaiping said that this time he came to Shanghai Science and Technology Park with a mentality of visiting and learning. Through his understanding of the overall positioning, development strategy, management mechanism, technology transfer and other aspects of the science and technology park, he has received great inspiration and help in the future construction and development of Chenzhou Science and Technology City.
      The talks were very successful, and both sides expressed their great confidence in establishing a technology transfer workstation in Chenzhou City and promoting local economic development.

                    


                                                                                                                  Provided by Technology Transfer Center
                                                                                                                     Editorial report from the External Relations Department